FIB-SEM with simultaneous milling and EBSD. The intrument allows preparation of high-quality ultra-thin TEM lamellae, delayering processes in technology nodes, precise nanopatterning and high-resolution 3D reconstructions.
FIB-SEM GAIA 3
General information
UNIT
CNR ICCOM
Category
Fabrications | Microscopy
Key instrumentation Electron Microscope / Scanning Probe Microscope
FIB-SEM with simultaneous milling and EBSD. The intrument allows preparation of high-quality ultra-thin TEM lamellae, delayering processes in technology nodes, precise nanopatterning and high-resolution 3D reconstructions. It has a unique 3-lens electron optical design capable of dedicated modes for extreme high-resolution imaging, enhanced depth of focus, undistorted ultra-low magnification imaging, and live 3D stereo imaging.
Technical description
It allows preparation of high-quality ultra-thin TEM lamellae, delayering processes in technology nodes, precise nanopatterning and high-resolution 3D reconstructions. It has a unique 3-lens electron optical design capable of dedicated modes for extreme high-resolution imaging, enhanced depth of focus, undistorted ultra-low magnification imaging, and live 3D stereo imaging. The smart chamber design of the instrument allows for the simultaneous milling and collection of EBSD patterns without the need to move the sample. This flexibility is unique to TESCAN and will provide best-in-class accuracy and throughput for EBSD and 3D-EDS.
