FIB-SEM GAIA 3

General information

UNIT
CNR ICCOM

Category

Fabrications | Microscopy

Key instrumentation
Electron Microscope / Scanning Probe Microscope

FIB-SEM with simultaneous milling and EBSD. The intrument allows preparation of high-quality ultra-thin TEM lamellae, delayering processes in technology nodes, precise nanopatterning and high-resolution 3D reconstructions. It has a unique 3-lens electron optical design capable of dedicated modes for extreme high-resolution imaging, enhanced depth of focus, undistorted ultra-low magnification imaging, and live 3D stereo imaging.

FIB-SEM with simultaneous milling and EBSD. The intrument allows preparation of high-quality ultra-thin TEM lamellae, delayering processes in technology nodes, precise nanopatterning and high-resolution 3D reconstructions.

 

Technical description
It allows preparation of high-quality ultra-thin TEM lamellae, delayering processes in technology nodes, precise nanopatterning and high-resolution 3D reconstructions. It has a unique 3-lens electron optical design capable of dedicated modes for extreme high-resolution imaging, enhanced depth of focus, undistorted ultra-low magnification imaging, and live 3D stereo imaging. The smart chamber design of the instrument allows for the simultaneous milling and collection of EBSD patterns without the need to move the sample. This flexibility is unique to TESCAN and will provide best-in-class accuracy and throughput for EBSD and 3D-EDS.
Research areas and applications
Science highlights

Experimental team

Instrument Scientist
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